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-25°C to +70°C
-40°C to +85°C

also ruggedized


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Embedded Technology

Pacifico Yokohama

18-20 Nov 2009

 

 

 


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03 July 2009                     

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Quad-core (2.13GHz) or Dual-core (2.0GHz) lntel® Xeon®  Processor SBC with 8 Mbytes last level cache, up to 64 Gbytes DDR3 1066 ECC SDRAM, 6 x SATA300,
8-port SAS RAID, 3 x Gig Ethernet, dual 10GBit Ethernet,  PMC/XMC, graphics, 5 x USB, 2 x Serial and PICMG 2.9

1.5 GHz Intel® Core™ 2 Duo processor 3U CompactPCI SBC with 4 Mbytes L2 cache, up to 4 Gbytes of DDR2 ECC SDRAM, 5 x SATA, 2 x Gig Ethernet, 2 x serial, 2 x USB and up to 3 x Flash Drives. Rugged options available. Ultra Low Power 1.6 GHz Intel® Atom™ processor 3U CompactPCI SBC with 512 Kbytes L2 cache, 1 Gbyte of DDR2-533 SDRAM, 4 x SATA, 2 x Gig Ethernet, 2 x serial, 5 x USB and up to 2 x CompactFlash Drives. Rugged options planned.

Up to 2.26 GHz Intel® Core™ 2 Duo processor VME/VXS SBC with 6 Mbytes L2 cache, up to 6 Gbytes of DDR3-1066 SDRAM, VITA 41.6, VITA 41.4, 3 x SATA, 2 x Gig Ethernet, Dual PMC/XMC, graphics, 2 x serial, 3 x USB. Up to 2.16 GHz Intel® Core™ 2 Duo processor AMC Module with 4 Mbytes shared L2 cache, up to 8 Gbytes DDR2 SDRAM, 4 x SATA, 3 x Gig Ethernet, PCI Express™ (x 8) data port, IPMI, 4 x USB and 2 x RS232. Ultra Low Power 1.6GHz Intel® Atom™ N270 processor 6U VME SBC with 512 Kbytes L2 cache, 2 Gbytes of DDR2-533 SDRAM, 2 x SATA, 4 x Ethernet, Dual PMC/XMC, graphics, 3 x USB, 2 x Serial, on-board CompactFlash. Rugged options planned.