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-25°C to +70°C
-40°C to +85°C

also ruggedized


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Electronica 2008, Munich, Germany
11-14 Nov 2008

 


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08 October 2008                     

Up to 2.16 GHz Intel® Core™ 2 Duo processor AMC Module with 4 Mbytes shared L2 cache, up to 8 Gbytes DDR2 SDRAM, 4 x SATA, 3 x Gig Ethernet, PCI Express™ (x 8) data port, IPMI, 4 x USB and 2 x RS232.
 

45nm 2.53 GHz Intel® Core™ 2 Duo Processor dual PMC/XMC carrier with 6 Mbytes L2 cache, up to 8 Gbytes DDR3 1066 SDRAM, EIDE, 4 x SATA300, 3 x Gig Ethernet, PMC/XMC, graphics, 4 x USB, 2 x Serial and PICMG 2.16 MicroTCA™  Development System, 5 AMC Slots with factory fitted dual-core processor AMC, graphics and storage AMC and MicroTCA Carrier Hub leaving 3 AMC  slots available.

1.66 GHz Dual-Core Intel® Xeon® processor VME SBC with 4 Mbytes L2 cache, up to Gbytes of DDR2-400 SDRAM, EIDE, 2 x SATA, 4 x Gig Ethernet, PMC/XMC, graphics, 4 x serial, 4 x USB.
 
1.5 GHz Intel® Core™ 2 Duo processor 3U CompactPCI SBC with 4 Mbytes L2 cache, up to 4 Gbytes of DDR2 ECC SDRAM, 5 x SATA, 2 x Gig Ethernet, 2 x serial, 2 x USB and up to 3 x Flash Drives. Rugged options available. 10/100/1000Mbps Ethernet Switched Fabric Board 24 ports - 19 node ports, 4 front panel interfaces and 1 fabric - fabric link, for use in PICMG 2.16 or VITA 31.1 packet switched backplane environments.