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November 2006 -
Concurrent Technologies announce their latest, very high performance Advanced
Mezzanine Card (AdvancedMC®) double width full height processor module
suitable for AdvancedTCA®, MicroTCA™ and proprietary platforms. The AM
100/20x uses the Dual-Core Intel® Xeon® processor to provide high
performance processing, and the Intel®
3100 chipset, which combines server-class memory and I/O controller
functions into a single component. The AM 100/20x is designed for use
in a variety of applications including wireless base stations, Voice
over IP, media-servers, blade-servers within the communication market as
well as projects within the defense, security, and industrial markets.
Accordingly, the AM 100/20x supports a variety of industry standard
operating systems.
Glen
Fawcett, CEO of Concurrent Technologies commented: “This new high
performance AMC processor board provides a marked improvement in
performance/watt compared to a single-core Intel® Xeon® processor. By
using processors and chipsets from Intel’s embedded roadmap, we can
ensure that the product will be available for at least 5 years after
release – a very important requirement for the majority of our customer
base, whether they are in the defense or telco market sectors.”
The AM
100/20x module supports the Dual-Core Intel Xeon Processor LV @ 2.0 GHz
or the Dual-Core Intel Xeon Processor ULV @ 1.66 GHz. By using
appropriate operating systems and applications software, a computing
performance increase, for the same clock frequency, of up to two times a
single-core Intel Xeon processor is achievable. The Thermal Design
Power (TDP) for the Dual-Core Intel Xeon Processor LV @ 2.0 GHz (667MHz
FSB, 2MB shared L2 cache) is 31W versus 35W TDP for the single-core LV
Intel Xeon processor @ 2.0 GHz (400MHz FSB, 512KB L2 cache); the
Dual-Core Intel Xeon Processor ULV @ 1.66 GHz (667MHz FSB, 2MB shared L2
cache) with a TDP of 15W gives a remarkable increase in
performance/watt.
To enhance
overall memory and I/O performance the AM 100/20x utilizes the Intel
3100 chipset. The Intel 3100 chipset, a single chip embedded server
chipset, interfaces up to 16 GBytes DDR2-400 ECC memory with a peak
memory bandwidth of 3.2 Gigabytes/s.
“For
military, defense and telco applications, the combination of the
Dual-Core Intel Xeon Processor LV and the Intel 3100 chipset is
maximizing energy efficient performance for thermally dense computing
environments like the AMC market segment,” says Rose Schooler, Director
of Marketing, Intel Infrastructure Processor Division. “For thirty
years Intel has been continuously supporting the embedded market
segment, and Concurrent Technologies is utilizing the benefits of
embedded Intel architecture to bring innovation and long term stability
to this leading edge standards-based form factor.”
The AM
100/20x is designed in compliance to AMC.0 (including full hot swap and
IPMI capabilities), AMC.1 Type 8 (PCI Express x8), AMC.2 Type E2 (2x
Gigabit Ethernet) and AMC.3 Type S2 (4x Serial ATA150 ports). The
module also features a graphics interface, four USB 2.0 ports and two
RS232 ports.
For ease of
integration, many of today’s leading operating systems are supported
including Linux®, Windows® 2000, Windows® Server 2003, Windows® XP,
Windows® XP Embedded and QNX®.
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Notes on AMC:
The
AdvancedMC (AMC) specification is ratified by PICMG® to be
compatible with the current AdvancedTCA (ATCA) and the
MicroTCA system architectures. The AMC concept provides a
system integrator with a modular approach that is scalable,
cost effective, fabric based, and hot swappable. The modules
are designed according to a series of AMC.x specifications -
where AMC.0 defines the form-factor, connector, power and
thermal characteristics, management, clocking and base
fabric, AMC.1 maps PCI Express onto the extended fabric
interface, AMC.2 defines Ethernet ports, AMC.3 defines mass
storage ports and AMC.4 defines Serial RapidIO. |