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November 2006 -
Concurrent Technologies announce their latest, very high performance
Advanced Mezzanine Card (AdvancedMC®) double width full height processor
module suitable for AdvancedTCA®, MicroTCA™ and proprietary platforms.
The AM 100/20x uses the Dual-Core Intel® Xeon® processor to provide high
performance processing, and the Intel® 3100 chipset, which combines
server-class memory and I/O controller functions into a single
component. The AM 100/20x is designed for use in a variety of
applications including wireless base stations, Voice over IP,
media-servers, blade-servers within the communication market as well as
projects within the defense, security, and industrial markets.
Accordingly, the AM 100/20x supports a variety of industry standard
operating systems.
Glen Fawcett, CEO of Concurrent
Technologies commented: “This new high performance AMC processor board
provides a marked improvement in performance/watt compared to a
single-core Intel® Xeon® processor. By using processors and
chipsets from Intel’s embedded roadmap, we can ensure that the product
will be available for at least 5 years after release – a very important
requirement for the majority of our customer base, whether they are in
the defense or telco market sectors.”
The AM 100/20x module supports the
Dual-Core Intel Xeon Processor LV @ 2.0 GHz or the Dual-Core Intel Xeon
Processor ULV @ 1.66 GHz. By using appropriate operating systems and
applications software, a computing performance increase, for the same
clock frequency, of up to two times a single-core Intel Xeon processor
is achievable. The Thermal Design Power (TDP) for the Dual-Core
Intel Xeon Processor LV @ 2.0 GHz (667MHz FSB, 2MB shared L2 cache) is
31W versus 35W TDP for the single-core LV Intel Xeon processor @ 2.0 GHz
(400MHz FSB, 512KB L2 cache); the Dual-Core Intel Xeon Processor ULV @
1.66 GHz (667MHz FSB, 2MB shared L2 cache) with a TDP of 15W gives a
remarkable increase in performance/watt.
To enhance overall memory and I/O
performance the AM 100/20x utilizes the Intel 3100 chipset. The
Intel 3100 chipset, a single chip embedded server chipset, interfaces up
to 16 GBytes DDR2-400 ECC memory with a peak memory bandwidth of 3.2
Gigabytes/s.
“For military, defense and telco
applications, the combination of the Dual-Core Intel Xeon Processor LV
and the Intel 3100 chipset is maximizing energy efficient performance
for thermally dense computing environments like the AMC market segment,”
says Rose Schooler, Director of Marketing, Intel Infrastructure
Processor Division. “For thirty years Intel has been
continuously supporting the embedded market segment, and Concurrent
Technologies is utilizing the benefits of embedded Intel architecture to
bring innovation and long term stability to this leading edge
standards-based form factor.”
The AM 100/20x is designed in compliance
to AMC.0 (including full hot swap and IPMI capabilities), AMC.1 Type 8
(PCI Express x8), AMC.2 Type E2 (2x Gigabit Ethernet) and AMC.3 Type S2
(4x Serial ATA150 ports). The module also features a graphics
interface, four USB 2.0 ports and two RS232 ports.
For ease of integration, many of today’s
leading operating systems are supported including Linux®, Windows® 2000,
Windows® Server 2003, Windows® XP, Windows® XP Embedded and QNX®.
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Notes on AMC:
The
AdvancedMC (AMC) specification is ratified by PICMG® to be
compatible with the current AdvancedTCA (ATCA) and the
MicroTCA system architectures. The AMC concept provides a
system integrator with a modular approach that is scalable,
cost effective, fabric based, and hot swappable. The modules
are designed according to a series of AMC.x specifications -
where AMC.0 defines the form-factor, connector, power and
thermal characteristics, management, clocking and base
fabric, AMC.1 maps PCI Express onto the extended fabric
interface, AMC.2 defines Ethernet ports, AMC.3 defines mass
storage ports and AMC.4 defines Serial RapidIO. |