Features

• Ruggedized dual PMC/XMC board for CompactPCI systems:
  • conduction-cooled to IEEE 1101.2
  • supports 2 conduction-cooled PMC or XMC modules conforming to ANSI/VITA 20
  • -40°C to +85°C operating temperature
  • conformally coated
    
• 1.86GHz Intel® Core™ 2 Duo processor:
  • 45nm process technology, dual-core processor
  • 1066MHz Front Side Bus
  • 6 Mbytes last-level cache shared between cores
  • Intel® 64 Technology (64-bit computing)
    
• Up to 8 Gbytes DDR3-1066 SDRAM
  
• 2 x PMC/XMC sites with rear user I/O:
  • 32/64-bit; 33/66MHz PCI; up to 100MHz PCI-X - 2 x XMC interfaces (x8 and x4 PCI Express®)
    
• 2 x SATA300 interfaces via rear I/O
  
• On-board CompactFlash® socket
  
• 2 x Universal Serial Bus (USB 2.0) interfaces
  
• 2 x 10/100/1000Mbps Ethernet interfaces:
  • Dual Gigabit Packet Switching Backplane (PICMG 2.16)
    
• 1 x RS232/RS422/RS485 serial channel interface
  
• Graphics, keyboard and mouse interfaces
  
• Optional Built-In Test (BIT) support:
  • Power-on BIT, Initiated BIT, Continuous BIT
    
• Watchdog timer and Long Duration Timer
  
• CompactPCI controller:
  • operates in system slot or peripheral slot
  • 32/64-bit at 33/66 MHz CompactPCI interface
    
• Option to bypass CompactPCI bus (Satellite Mode)
  
• IPMI (Intelligent Platform Management Interface)
  
• PICMG 2.9 (System Management Specification)
  
• Ruggedized air-cooled versions:
  • -40°C to +75°C, conformally coated
• Non-ruggedized air-cooled versions:
  • see separate PP 531/06x datasheet
  • rear plug compatible with the ruggedized versions
  • useful for bench development
  • use in commercial (non-rugged) applications
    
• Support for Linux®, Windows® XP, Windows® XP Embedded, Windows® Server 2003, Windows® Server 2008, QNX®, Solaris™ and VxWorks®