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Specification Sheet: PP 531/06x
High performance dual PMC/XMC CompactPCI board

(click to view Ruggedized Air-Cooled or Ruggedized Conduction-Cooled)



Central Processor

  • 2.26 GHz Intel® Core™ 2 Duo SP9300 or
    1.86 GHz Intel® Core™ 2 Duo SL9400
  • common processor features:-
    • 45nm process technology
    • soldered to board
    • 1066 MHz Front Side Bus
    • 6 Mbytes of shared last-level on-die cache
  • Intel 64 technology (64-bit computing)
  • no CPU fan
  • utlizes Intel® GS45 mobile class chipset with Intel ICH9M-E I/O Controller Hub
  • provision for XDP debug port

SDRAM

  • supports up to 8 Gbytes DDR3-1066 SDRAM:-
    • up to 8 Gbyte soldered
    • peak bandwidth of 16 Gbytes/s
    • dual channel architecture
  • accessible by CPU and from CompactPCI® bus

Mass Storage Interfaces

  • 2 SATA interfaces via J5
  • 1 x SATA 300 interface for on-board hard disk or solid state drive (uses a PMC/XMC site)
  • 1 x SATA 300 interface for on-board CompactFlash socket via EIDE converter

Ethernet Interfaces

  • 2 x front interfaces implemented by Intel® 82574L controllers via x1 PCI Express™ links
  • 1 x rear interface via J3 implemented by Intel 82574L controller via x1 PCI Express link
  • 1 x rear interface via J3 implemented by an Intel® 82567 Gigabit Ethernet controller
  • support for PICMG 2.16 R1.0 - Packet Switching Backplane (PSB)
  • supports 10 Base-T, 100 Base-TX, 1000 Base-T
  • support for Wake-On-Lan

PMC/XMC Interfaces

  • 2 x PMC/XMC sites
  • common features for both PMC sites:-
    • 32/64-bit, 33/66MHz PCI bus
    • 64-bit PCI-X bus up to 100MHz
    • 5V and 3.3V signaling levels
    • front panel I/O and Pn4 connectors used for rear I/O
  • XMC (PCI Express™ Mezzanine Card) features:-
    • XMC site 2 interface supported via x4 PCI Express link
    • XMC site 1 interface supported via x8 PCI Express link

Graphics Interface

  • implemented by Intel GS45 chipset
  • analog VGA accessed via J5 rear I/O
    • resolutions up to 2048 x 1536 @ 16M colors

Serial Interface

  • 1 x RS232/RS422/RS485 serial channel:-
    • Tx, Rx, CTS and RTS signals via J5
  • 16550 compatible UART

Flash EPROM

  • 4 Mbytes of BIOS Flash EPROM - 8-bits wide

Firmware Support

  • Phoenix® TrustedCore BIOS
  • comprehensive Power-On Self-Test (POST)
  • LAN boot firmware included

Software Support

  • support for Linux®, Windows® XP, Windows®, XP Embedded, Windows® Server 2003, Windows® Server 2008, QNX®, Solaris™ and VxWorks®
 

Other Peripheral Interfaces

  • PC Real Time Clock (Year 2000 compliant)
  • watchdog timer
  • 1 x 32-bit Long Duration Timer with processor interrupt capability
  • CPU temperature monitor; voltages monitor; optional system fan monitor:-
    • accessible via IPMI
  • GPIO signals:-
    • 4 x GPO and 8 x GPI multiplexed signals via AD PP5/006 RTM or
    • 3 direct GPIO signals via J5
  • 4 x USB 2.0 interfaces:-
    • 2 accessed via J5
    • 2 accessed via front panel
  • independent legacy speaker output via J3
  • keyboard and mouse

CompactPCI Interface

  • compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels (universal signaling support)
  • 33/66 MHz, 32/64-bit interface accessed via J1/J2 connectors
  • PCI Express to PCI bridge for off-board accesses
  • J4 connector not fitted
  • PICMG 2.1 R2.0 Hot Swap compliant
  • operates as a System Slot controller or in a Peripheral slot
  • option to disable CompactPCI interface (Satellite Mode):-
    • receives power from CompactPCI bus
    • board can be hot swapped

IPMI

  • PICMG 2.9 R1.5 (System Management Spec.):-
    • implements the IPMB0 interface
    • implements an IPMB1 interface
  • on-board Baseboard Management Controller
  • supports 8 Kbytes of non-volatile memory

Electrical Specification

  • typical current at 1.86 GHz (4 Gbytes SDRAM):-
    • +5V @ 3.9A; voltage +5% / -3%
    • +3.3V @ 3.5A; voltage +5% / -3%
  • +12V @ 0.01A; voltage +5% / -3%
  • -12V not required
  • +12V and -12V routed to PMC slots

Safety

  • PCB (PWB) manufactured with flammability rating of 94V-0

Environmental Specification

  • operating temperatures:-
    • 0°C to +55°C (N-Series)
    • -25°C to +70°C (E-Series, 1.86 GHz)
    • -40°C to +85°C (K-Series, 1.86 GHz)
  • storage temperature: -40°C to +85°C
  • 5% to 95% Relative Humidity, non condensing (operating or storage):-
    • K-Series includes humidity sealant
  • ruggedized versions available, see separate datasheets:-

Mechanical Specification

  • 6U form-factor: 9.2inches x 6.3inches (233mm x 160mm)
  • single-slot: 0.8inches (20.3mm)
  • connectors: IEC-1076-4-101 for J1-J5
  • shock: 20g, 11ms, ˝ sine (operating); 30g, 11ms, ˝ sine (non-operating)
  • vibration: 5Hz-2000Hz at 2g, 0.38mm peak displacement (operating);
  • 5Hz-2000Hz at 5g, 0.76mm peak displacement (non-operating)