Specification Sheet: PP 712/08x
Intel® Core™ i7 Processor (32nm) Dual PMC/XMC Carrier
Central Processor
- 2.53 GHz Intel® Core™ i7-610E processor,
2.0 GHz Intel® Core™ i7-620LE processor or
1.06 GHz Intel® Core™ i7-620UE processor - common processor features are:-
- 32nm process technology
- dual-core processor
- 4 Mbytes shared last level cache
- Intel® Hyper-Threading Technology
- Intel® 64 Technology (64-bit computing)
- Intel® Turbo Boost technology
- uses Ball Grid Array package
- processor to DRAM memory
bus speed:-
- 610E and 620LE - 1066MHz
- 620UE - 800MHz
- graphics engine
clock speed:-
- 610E - 500MHz
- 620LE - 266MHz
- 620UE - 166MHz
- Intel Turbo Boost technology allows faster graphics engine speed depending on the CPU loading
- utilizes Intel® Platform Controller Hub (PCH):-
- Mobile Intel® QM57 Express chipset
SDRAM
- up to 8 Gbytes DDR3-1066 ECC SDRAM:-
- via two SODIMM sockets
- single bit error correction
- peak bandwidth of 17 Gbytes/s
- dual channel architecture
- accessible from processor and CompactPCI bus
Mass Storage Interfaces
- 1 x EIDE interface supports on-board CompactFlash™ socket
- 4 x external Serial ATA300 interfaces:-
- transfer rate up to 300 Mbytes/s
- optional on-board 2.5 inch SATA300 disk drive
- optional USB Flash disk on Transition Module
Ethernet Interfaces
- 3 x Gigabit Ethernet interfaces
- front panel interface implemented by Intel® 82577 via x1 PCI Express™ link via RJ45
- 2 x rear interfaces implemented by Intel® 82574L controllers via x1 PCI Express link:-
- support for PICMG® 2.16 R1.0 - Packet Switching Backplane (option)
- supports 10 Base-T 100 Base-TX 1000 Base-T
PMC/XMC Interfaces
- 2 x PMC sites supporting:-
- 32/64-bit 33/66/100/133 MHz PCI/PCI-X
- 3.3V or 5V PCI signaling
- separate PCI Express to PCI-X bridges
- I/O via front and rear panel via Pn4
- 2 x XMC sites supporting:-
- up to x8 PCI Express link
- full duplex Pn6 to Pn6 connections (option)
Serial Interfaces
- 2 x RS232 serial channels:-
- 1 x Tx/Rx channel accessed via a 60-way high-density connector on front panel
- 1 x Tx/Rx channels via Transition Module
- 16550 compatible UARTs
- front panel supports CTS and RTS and rear panel supports RI CTS RTS DSR DTR and DCD
Stereo Audio
- Intel® High Definition Audio via J5:-
- optional codec module on Transition Module
Graphics Interface
- implemented by the integrated chipset graphics controller
- resolutions up to 2048 x 1536 @ 1073M colors
- dual digital DVI-D and single analog VGA via front panel:-
- digital up to 1600 x 1200 @ 16M colors
- analog up to 2048 x 1536 @ 1073M colors
- support for Microsoft® DirectX 10
- support for OpenGL 2.0 Windows® and Linux®
- accessed via 60-way high-density connector
Other Peripheral Interfaces
- PC Real Time Clock (Year 2000 compliant)
- watchdog timer; 32-bit Long Duration Timer with processor interrupt ability; chipset timer
- system fan monitor; CPU temperature monitor; voltages monitor; all accessible via IPMI
- 5 x USB 2.0 interfaces:-
- 2 accessed via a 60-way high-density connector on front panel
- 3 interfaces accessed via J5
- independent legacy speaker output via J3
Firmware Support
- UEFI-compliant BIOS with legacy mode support
- comprehensive Power-On Self-Test (POST)
- LAN boot firmware included
Software Support
- support for Linux®, Windows® XP, Windows® XP Embedded, Windows® Server 2003, QNX®, Windows® Server 2008, VxWorks® and Solaris™
Flash EPROM
- 8 Mbytes of BIOS Flash EPROM
IPMI
- PICMG 2.9 R1.0 (System Management Spec.):-
- implements the IPMB0 interface
- implements an IPMB1 interface
- on-board Baseboard Management Controller
- supports 8 Kbytes of non-volatile memory
Safety
- PCB (PWB) manufactured with flammability rating of 94V-0
CompactPCI Interface
- compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels (universal signaling support)
- 33/66 MHz 32/64-bit interface accessed via J1/J2 connectors
- PCI Express to PCI bridge for off-board accesses
- J4 connector not fitted
- PICMG 2.1 R2.0 Hot Swap compliant
- operates as System Slot controller or in a Peripheral slot
- option to disable CompactPCI interface (Satellite Mode):-
- receives power from CompactPCI bus
- board can be hot swapped
Electrical Specification
- +5V @ 5.7A (typical with 2.53 GHz processor and 4 Gbytes SDRAM); voltage +5%/-3%
- +3.3V @ 5.4A; voltage +5%/-3%
- +12V @ 0.01A; -12V @ 0.0A
- +12V and -12V routed to PMC/XMC slots
Environmental Specification
- operating temperatures:-
- 0°C to +55°C (N-Series)
- -25°C to +70°C (E-Series: 2.0 GHz or 1.06 GHz)
- -40°C to +85°C (K-Series: 2.0 GHz or 1.06 GHz)
- storage temperature - -40°C to +85°C
- 5% to 95% Relative Humidity
non condensing (operating or storage):-
- K-Series includes humidity sealant
Mechanical Specification
- 6U form-factor: 9.2inches x 6.3inches (233mm x 160mm)
- single-slot: 0.8inches (20.3mm)
- connectors: IEC-1076-4-101 for J1-J5
- shock: 20g, 11ms, ½ sine (operating);
30g, 11ms, ½ sine (non-operating) - vibration: 5Hz-2000Hz
at 2g, 0.38mm peak displacement (operating);
at 5g, 0.76mm peak displacement (non-operating)