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Specification Sheet: PP XMC/202
- Dual XMC/PMC Carrier Board

(click to view Ruggedized Air-Cooled or Ruggedized Conduction-Cooled)



XMC AND PMC INTERFACES

  • Supports 2 single size XMC or PMC modules (or as one dual width module):

    • a single PMC and a single XMC module can be used simultaneously

    • supports non-Monarch Processor XMC/PMC modules

  • XMC module interface requirements:

    • x1, x2 or x4 PCI Express

    • logical and electrical layer meets specification PCI Express 1.1

  • PMC module interface requirements:

    • 5 Volt or 3.3 Volt signaling

    • 32/64-bit and 33/66 MHz PCI/PCI-X

    • logical and electrical layer meets specification PCI-X 1.0

  • complies with CMC (Common Mezzanine Card) standard IEEE 1386-2001 and PMC (PCI Mezzanine Card) standard IEEE 1386.1-2001

  • front panel I/O, and rear I/O via J3 and J5 connectors:-

    • 64 I/O signals per XMC/PMC site

    • rear I/O routed as differential pairs

    • rear I/O options for XMC Pn6 or PMC Pn4 connectors

    • can connect to an optional Rear Transition Module (AD PP5/002)

HOT SWAP FUNCTION

  • permits live insertion and extraction of PP XMC/202 carrier

  • supports Basic and Full Hot Swap

  • compatible with PICMG® 2.1, Rev 2.0 Hot Swap specification

  • Hot Swap capable register:-

    • insertion

    • extraction

    • ENUM  mask/enable

    • front panel blue LED

  • CompactPCI backplane interface signals:-

    • ENUM (board insertion/extraction indication)

    • healthy (power)

COMPACTPCI BUS INTERFACE

  • occupies one 6U CompactPCI slot

  • conforms to PICMG 2.0 R3.0:-

    • supports 3.3V and 5V signaling

    • 32/64-bits at 33/66 MHz

  • PLX Technology PCI 6540 PCI to PCI bridge

 

 

OTHER FEATURES

  • front panel activity LED:-

    • flashes with on-board PCI bus activity

  • front panel fault LED:-

    • reports power fault or PCI bus error conditions

ELECTRICAL SPECIFICATION

  • +5V@0.0A; +5%/-3%

  • +3.3V@1.0A; +5%/-3%

  • +12V@0.002A;

  • -12V@0.0A

  • all figures are typical

  • maximum power per XMC module is 25 Watts

ENVIRONMENTAL SPECIFICATION

  • operating temperatures:-

    • 0°C to +55°C (N-Series)

    • -25°C to +70°C (E-Series)

    • -40°C to +85°C (K-Series)

  • storage temperature: -40°C to +85°C

  • 5% to 95% Relative Humidity, non condensing (operating or storage):-

    • K-Series includes humidity sealant

  • ruggedized versions planned, see separate datasheets:-

SAFETY

  • PCB (PWB) manufactured with flammability
    rating of 94V-0

MECHANICAL SPECIFICATION

  • 6U form-factor: 9.2” x 6.3”
    (233.4mm x 160mm)

  • utilizes a single CompactPCI slot: 0.8” (20.3mm)

  • connectors: IEC-1076-4-101 for J1, J2, J3, J5

  • shock:
    20g, 11ms, ½ sine (operating);
    30g, 11ms, ½ sine (non-operating)

  • vibration: 
    5Hz-2000Hz at 2g, 0.38mm peak displacement (operating);
    5Hz-2000Hz at 5g, 0.76mm peak displacement (non-operating)