PP XMC/M02 - Dual XMC/PMC Carrier Board
The PP XMC/M02 dual XMC/PMC carrier board provides a flexible solution for designers wishing to add functionality to 6U CompactPCI® systems by using XMC or PMC modules. The carrier can accommodate two single or one dual width, PMC or XMC modules conforming to the IEEE 1386 Common Mezzanine Card standard. The PP XMC/M02 can support up to 100 MHz PCI/PCI-X PMC modules and x4 PCI Express® XMC modules. A wide range of XMC/PMC modules can be supported, including processor modules (Root-Complex or Monarch), SAS, SATA, LAN, WAN, Graphics and Communications Controllers. The PP XMC/M02 board supports the CompactPCI hot swap mode which enables live insertion and extraction of the carrier allowing modules to be added, replaced or upgraded without interruption to the system operation. Rear I/O signals from each of the XMC/PMC sites are routed via either PMC Pn4 or XMC Pn6 rear I/O connectors to the CompactPCI J3 and J5 connectors. For harsher environments, extended temperature, ruggedized air-cooled and ruggedized conduction-cooled versions are supported.
Features
- Supports 2 single size XMC or PMC modules (or as one
dual width module)
- A single XMC and a single PMC module can be used
simultaneously
- Processor module support available on site 1:
- Monarch and Root-Complex modes
- Non-Monarch and End-Point modes are supported on
both sites
- Concurrent Technologies provide a range of processor modules supporting Intel® Core™ i7 and Intel® Atom™ processors
- XMC module interfaces support:
- x1, x2 or x4 PCI Express®
- x1, x2 or x4 PCI Express®
- PMC module interfaces supports:
- 5 Volt or 3.3 Volt signaling
- 32/64-bit and 33/66/100 MHz PCI/PCI-X
- Front panel I/O, and rear I/O via J3 and J5
connectors:
- rear I/O options for XMC Pn6 or PMC Pn4
connectors
- rear I/O routed as differential pairs
- rear I/O options for XMC Pn6 or PMC Pn4
connectors
- "Hot Swap” live insertion and extraction:
- PICMG® 2.1 (Hot Swap specification)
- IPMI (Intelligent Platform Management Interface):
- PICMG 2.9 (System Management Specification)
- PICMG 2.9 (System Management Specification)
- Occupies one 6U CompactPCI slot:
- 5 Volt or 3.3 Volt signaling
- 32/64-bit and 33/66 MHz
- Extended temperature versions (E-Series, K-Series):
- E: -25°C to +70°C, air-cooled
- K: -40°C to +85°C, humidity sealant, air-cooled
- E: -25°C to +70°C, air-cooled
- Ruggedized versions (RA-Series, RC-Series):
- RA: -40°C to +75°C, conformally coated, air-cooled
- RC: -40°C to +85°C, conformally coated, conduction-cooled (at card edge) to ANSI/VITA 30.1-2002
- 3.3 Volt, 5 Volt, +12 Volt and -12 Volt provided for XMC and PMC modules via CompactPCI backplane
- A Rear Transition Module is available
Request a Technical Reference Manual
View the ruggedized conduction-cooled variant
View the ruggedized air-cooled variant
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