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TP 702/38x - Intel® Core™ i7 Processor (32nm) 3U Single Board Computer
The TP 702/38x is a PC-compatible high performance, high functionality 3U CompactPCI® board supporting the Intel® Core™ i7 processor up to 2.53 GHz (32nm process technology), the Mobile Intel® QM57 Express chipset and up to 8 Gbytes of DDR3-1066 ECC SDRAM. This single slot board features a variety of interfaces including dual Serial ATA150, dual Gigabit Ethernet, RS-232/422 and USB. The TP 702/38x is capable of operating in temperatures ranging from -40°C to +85°C where it is suitable for a range of demanding applications within the defense, industrial control, telecomms, telemetry, scientific and aerospace markets. For harsher environments, extended temperature, ruggedized air-cooled and ruggedized conduction-cooled versions are supported. The board is plug compatible with the popular TP 402/35x family. To simplify the board’s integration many popular industry standard operating systems are supported.
Features
- 2.53 GHz, 2.0 GHz or 1.33 GHz Intel® Core™ i7
processor:
- dual-core processor
- 1066MHz DRAM Bus (800 MHz for 1.33 GHz processor)
- 4 Mbytes shared last level cache
- Intel® Hyper-Threading Technology
- Intel® Turbo Boost technology
- Intel® 64 Technology (64-bit computing support)
- Up to 8 Gbytes of dual channel DDR3-1066 ECC SDRAM
- 2 x 10/100/1000Mbps Ethernet interfaces accessed via
J2
- 5 x Serial ATA channels:
- 2 x SATA150 channels accessed via J2
- 1 x SATA300 channel for optional on-board Flash Drive
- 2 x SATA300 channels routed to optional dual
Flash Drives
- 2 serial channel interfaces accessed via J2
- 2 x USB 2.0 interfaces accessed via J2
- Option for analog graphics via J2
- Watchdog and long duration timer
- CompactPCI controller: -
- operates in the system slot or in a peripheral slot
- 32-bit at 33/66 MHz CompactPCI interface
- Option to bypass CompactPCI bus (Satellite Mode)
- Optional Built-In Test (BIT) support:
- Power-on BIT, Initiated BIT, Continuous BIT
- Power-on BIT, Initiated BIT, Continuous BIT
- Extended temperature versions (E-Series, K-Series):
- E: -25°C to +70°C, air-cooled
- K: -40°C to +85°C, humidity sealant, air-cooled
- Ruggedized versions (RA-Series, RC-Series):
- RA: -40°C to +75°C, conformally coated, air-cooled
- RC: -40°C to +85°C, conformally coated,
conduction-cooled (at card edge) to ANSI/VITA
30.1-2002
- Support for Linux®, Windows® 7, Windows® Embedded Standard 7, Windows® XP, Windows® XP Embedded, Windows® Server 2003, Windows® Server 2008, QNX®, Solaris™ and VxWorks®
Request a Technical Reference Manual
View the ruggedized conduction-cooled variant
View the ruggedized air-cooled variant
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