Central Processor

• 1.6 GHz Intel® Atom™ processor Z530:-
  • 512 Kbytes of secondary (L2) on-die cache
  • 533 MHz Front Side Bus
  • Intel Hyper-Threading Technology supporting 2 execution threads
  • Intel® Virtualization Technology
• uses Small Form Factor packaging
• (micro Flip-Chip Ball Grid Array) package
• utilizes Intel® System Controller Hub US15W (SCH)

DRAM

• 1 Gbyte soldered DDR2-533 SDRAM
• accessible from processor or CompactPCI® bus

Optional Second Slot Boards

• second slot board, two options (see diagram)
• option 1 supports onboard:-
  • PMC/XMC site or 2.5" SATA300 disk drive
  • CompactFlash site
• option 2 supports onboard:-
  • SATA300 disk drive (or external disk drive)
  • CompactFlash site, accessible via front panel

PMC/XMC Interface

• single PMC/XMC site available on an optional second slot board (option 1 in diagram):-
  • 32-bit, 33/66 MHz PCI operation
  • 3.3V and 5V PCI signaling levels
  • XMC (Switched Mezzanine Card) interface supported via x1 PCI Express® port
  • I/O via front panel and 64 bits via J2 on optional second slot board

Mass Storage Interfaces

• 4 x Serial ATA300 interfaces:-
  • transfer rate up to 300 Mbytes/s
  • 2 x channels accessible via J2
  • 1 x channel routed to 2.5" SATA300 disk drive on both types of optional second slot board (uses PMC/XMC site on option 1)
  • 1 x channel routed to a CompactFlash® site (type 1) on both second slot board options
• 1 x EIDE interface:-
  • supports an on-board CompactFlash® site (type 1) on the single slot base board

Ethernet Interfaces

• up to 2 x channels supporting:-
  • 10 Base-T, 100 Base-TX, 1000 Base-T
  • implemented by Intel® 82546GB via PCI-X 66 bus
• 1 x channel accessed via front panel RJ45
• option for one channel accessed via J2

Stereo Audio

• Intel® High Definition Audio interface via J2 supports Stereo Audio Codec on optional Rear Transition Module (RTM)

Flash EPROM

• 1 Mbyte of BIOS Flash EPROM

Graphics Interface

• implemented by the Intel® US15W SCH
• analog VGA accessed via a 15-way high density connector on front panel or optionally via J2:-
  • resolutions up to 2048 x 1536 @ 16M colors

Serial Interfaces

• 1 x RS232 serial channel accessed via front panel RJ45 connector or J2:-
  • supporting CTS, RTS, DSR, DTR and DCD
• option for 1 x RS232/422/485 serial channel accessed via J2:-
  • supporting RI, CTS, RTS, DSR, DTR and DCD
• 16550 compatible UARTs

Other Peripheral Interfaces

• PC Real Time Clock (Year 2000 compliant)
• long duration timer; watchdog timer
• legacy speaker interface
• 5 x USB 2.0 interfaces:-
  • 3 channels accessed via J2
  • 2 channels accessed via front panel
• 2 x GPIO signals via J2
• High Speed CANbus controller:-
  • up to 1 Mbps

CompactPCI Interface

• universal signaling support, compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels
• 33/66 MHz; 32-bit interface accessed via J1
• operates as a System Slot controller (supporting up to 7 peripheral slots) or operates in a Peripheral Slot
• PICMG 2.1 R2.0 Hot Swap Compliant
• option to disable CompactPCI interface (Satellite Mode):-
  • receives power from CompactPCI bus
  • board can be hot swapped

IPMI

• PICMG 2.9 R1.0 (System Management Specification):-
  • implements the IPMB0 interface
• on-board Baseboard Management Controller
• monitors CPU temperature, voltages and fan
• supports 8 Kbytes of non-volatile memory

Software Support

• supports Linux®, Windows® XP, Windows® XP Embedded, QNX®, and VxWorks®

Firmware Support

• Phoenix™ TrustedCore BIOS
• comprehensive Power-On Self-Test (POST)
• LAN boot firmware included

Electrical Specification

• +5V@0.9 A
• +3.3V@2.3 A
• +12V@ 0.01 A
• -12V not required
• all voltages are tolerant to +5% / -3%

Safety

• PCB (PWB) manufactured with flammability rating of 94V-0

Environmental Specification

• operating temperatures:-
  • 0°C to +55°C (N-Series)
  • -25°C to +70°C (E-Series)
  • -40°C to +85°C (K-Series)
• 5% to 95% Relative Humidity, non condensing (operating):-
  • K-Series includes humidity sealant
• -40°C to +85°C (storage)
• 5% to 95% Relative Humidity, non condensing (storage)
• ruggedized versions planned

Mechanical Specification

• 3U form-factor: 3.9 inches x 6.3 inches
• (100mm x 160mm)
• single or dual slot
• connectors: IEC-1076-4-101 for J1-J2
• shock:
  • 20g, 11ms, ½ sine (operating);
  • 30g, 11ms, ½ sine (non-operating)
• vibration:
  • 5Hz-2000Hz at 2g, 0.38mm peak displacement (operating);
  • 5Hz-2000Hz at 5g, 0.76mm peak displacement (non-operating)