(click to view Ruggedized Air-Cooled or Ruggedized Conduction-Cooled)
Central Processor
- 1.6 GHz Intel® Atom™ processor Z530:-
- 512 Kbytes of secondary (L2) on-die cache
- 533 MHz Front Side Bus
- Intel Hyper-Threading Technology supporting 2 execution threads
- Intel® Virtualization Technology
- uses Small Form Factor packaging
- (micro Flip-Chip Ball Grid Array) package
- utilizes Intel® System Controller Hub US15W
DRAM
- up to 2 Gbytes soldered DDR2-533 SDRAM
- accessible from processor or CompactPCI® bus
Optional Second Slot Boards
- second slot board, two options (see diagram)
- option 1 supports onboard:-
- PMC/XMC site or 2.5" SATA300 disk drive
- CompactFlash site
- option 2 supports onboard:-
- SATA300 disk drive (or external disk drive)
- CompactFlash site, accessible via front panel
PMC/XMC Interface
- single PMC/XMC site available on an optional second slot board (option 1 in diagram):-
- 32-bit, 33/66 MHz PCI operation
- 3.3V and 5V PCI signaling levels
- XMC (Switched Mezzanine Card) interface supported via x1 PCI Express® port
- I/O via front panel and 64 bits via J2 on optional second slot board
Mass Storage Interfaces
- 4 x Serial ATA300 interfaces:-
- transfer rate up to 300 Mbytes/s
- 2 x channels accessible via J2
- 1 x channel routed to 2.5" SATA300 disk drive on both types of optional second slot board (uses PMC/XMC site on option 1)
- 1 x channel routed to a CompactFlash® site (type 1) on both second slot board options
- 1 x EIDE interface:-
- supports an on-board CompactFlash® site (type 1) on the single slot base board
Ethernet Interfaces
- 2 x channels supporting:-
- 10 Base-T, 100 Base-TX, 1000 Base-T
- implemented by Intel® 82546GB via PCI-X 66 bus
- 1 x channel accessed via either the front panel RJ45 or via J2
- 1 x channel accessed via J2
Stereo Audio
- Intel® High Definition Audio interface via J2 supports Stereo Audio Codec on optional Rear Transition Module (RTM)
Flash EPROM
- 1 Mbyte of BIOS Flash EPROM
Graphics Interface
- implemented by the Intel® US15W SCH
- analog VGA accessed via a 15-way high density connector on front panel or optionally via J2:-
- resolutions up to 2048 x 1536 @ 16M colors
Serial Interfaces
- 1 x RS232 serial channel accessed via front panel RJ45 connector or J2:-
- supporting CTS, RTS, DSR, DTR and DCD
- 1 x RS232/422/485 serial channel accessed via J2:-
- supporting RTS and DTR only
- 16550 compatible UARTs
Other Peripheral Interfaces
- PC Real Time Clock (Year 2000 compliant)
- long duration timer; watchdog timer
- legacy speaker interface
- 5 x USB 2.0 interfaces:-
- 3 channels accessed via J2
- 2 channels accessed via front panel
- 2 x GPIO signals via J2
- High Speed CANbus controller:-
- up to 1 Mbps
CompactPCI Interface
- universal signaling support, compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels
- 33/66 MHz; 32-bit interface accessed via J1
- operates as a System Slot controller (supporting up to 7 peripheral slots) or operates in a Peripheral Slot
- PICMG 2.1 R2.0 Hot Swap Compliant
- option to disable CompactPCI interface (Satellite Mode):-
- receives power from CompactPCI bus
- board can be hot swapped
IPMI
- PICMG 2.9 R1.0 (System Management Specification):-
- implements the IPMB0 interface
- on-board Baseboard Management Controller
- monitors CPU temperature, voltages and fan
- supports 8 Kbytes of non-volatile memory
Software Support
- supports Linux®, Windows® XP, Windows® XP Embedded, QNX®, and VxWorks®
Firmware Support
- Phoenix™ TrustedCore BIOS
- comprehensive Power-On Self-Test (POST)
- LAN boot firmware included
Electrical Specification
- typical current figures (1 Gbyte SDRAM)
- +5V@ 1.2A
- +3.3V@ 1.8A
- +12V@ 0.01 A
- -12V not required
- all voltages are tolerant to +5% / -3%
Safety
- PCB (PWB) manufactured with flammability rating of 94V-0
Environmental Specification
- operating temperatures:-
- 0°C to +55°C (N-Series)
- -25°C to +70°C (E-Series)
- -40°C to +85°C (K-Series)
- 5% to 95% Relative Humidity, non condensing (operating):-
- K-Series includes humidity sealant
- -40°C to +85°C (storage)
- 5% to 95% Relative Humidity, non condensing (storage)
- ruggedized versions planned
Mechanical Specification
- 3U form-factor: 3.9 inches x 6.3 inches
- (100mm x 160mm)
- single or dual slot
- connectors: IEC-1076-4-101 for J1-J2
- shock:
- 20g, 11ms, ½ sine (operating);
- 30g, 11ms, ½ sine (non-operating)
- vibration:
- 5Hz-2000Hz at 2g, 0.38mm peak displacement (operating);
- 5Hz-2000Hz at 5g, 0.76mm peak displacement (non-operating)