![]()
XP 732/x8x - Intel® Core™ i7 Processor XMC Module
The XP 732/x8x is a PC-compatible high performance, high functionality, Processor XMC module supporting the Intel® Core™ i7 processor, the Mobile Intel® QM57 Express chipset and up to 8 Gbytes of DDR3 ECC SDRAM. This board features a variety of interfaces including dual Gigabit Ethernet/SerDes, dual SATA, RS232/422/485, graphics and USB interfaces. The XP-732/x8x is a commercial air-cooled board, suitable for a range of environments within industrial control, transportation, security, telemetry, scientific and medical applications. Options to operate in temperatures ranging from -40°C to +85°C are available, with ruggedized conduction-cooled and ruggedized air-cooled versions for harsh environments. To simplify the board’s integration many industry standard operating systems are supported.
Features
- 1.33 GHz Intel® Core™ i7 processor:
- dual-core processor
- 800MHz DRAM Bus
- 4 Mbytes shared last level cache
- Intel® Hyper-Threading Technology
- Intel® Turbo Boost technology
- Intel® 64 Technology (64-bit computing support)
- Up to 8 Gbytes of dual channel DDR3 ECC SDRAM
- XMC interface supports x8 or dual x4 PCI Express®:
- supports DMA via XMC host interface
- supports Root Complex and Endpoint operation
- I/O via XMC Pn6 or via PMC Pn4 connector
- Up to 2 x SATA disk interfaces
- On-board EIDE NAND Flash drive
- Options for Gigabit Ethernet and 1000Base-BX
interfaces
- Up to 3 x USB 2.0 interfaces
- 2 x serial ports
- Digital graphics interface
- Up to 4 x GPIO interfaces
- Watchdog timer; Long Duration Timer
- Optional Built-In Test (BIT) support:
- Power-on BIT, Initiated BIT, Continuous BIT
- Power-on BIT, Initiated BIT, Continuous BIT
- Extended temperature version (E-Series):
- E: -25°C to +70°C, air-cooled
- E: -25°C to +70°C, air-cooled
- Ruggedized versions (RA-Series, RC-Series):
- RA: -40°C to +75°C, conformally coated, air-cooled
- RC: -40°C to +85°C, conformally coated,
conduction-cooled (at card edge) to ANSI/VITA
20-2001
- Single-width XMC form factor
- For use with VPX, VME, VXS, CompactPCI® and other
XMC Host Boards
- Linux®, Windows® 7, Windows® Embedded Standard 7, Windows® XP, Windows® XP Embedded, QNX® and VxWorks®
- Linux PCI Express device driver available
Request a Technical Reference Manual
View the ruggedized conduction-cooled variant
View the ruggedized air-cooled variant
| Contact Us: | sales@gocct.com Sales Channels |