CENTRAL PROCESSOR

• 2.53 GHz Intel® Core™ 2 Duo processor T9400:-

  • 45nm process technology

  • uses mFC-PGA 478 (micro Flip-Chip Ball Grid Array) package

  • 1066 MHz Front Side Bus

  • 6 Mbytes of shared Level 2 on-die cache

  • Intel® 64 Technology (64-bit computing)

• no CPU fan

• utilizes Intel® GM45 mobile class chipset:-

  • uses Intel® ICH9M I/O Controller Hub

• provision for XDP debug port

DRAM

• supports up to 8 Gbytes DDR3-1066 SDRAM:-

  • up to 8 Gbytes via two SODIMM sockets

  • peak bandwidth of 16 Gbytes/s

  • dual channel architecture

• accessible from processor and CompactPCI bus

MASS STORAGE INTERFACES

• up to 4 x SATA300 interfaces via J5

• option to use 1 x SATA for on-board disk drive (uses PMC/XMC site 1)

• option to use 1 x SATA for on-board EIDE interface:-

  • supports up to Ultra-DMA 100

  • used for on-board CompactFlash™ site under PMC/XMC site

• option for USB Flash disk on Transition Module

ETHERNET INTERFACES

• 2 x rear interfaces implemented by Intel® 82574L controllers via x1 PCI Express™ links:-

  • support for PICMG® 2.16 R1.0 - Packet Switching Backplane (PSB)

• front panel interface implemented by Intel® 82541PI, accessed via front panel RJ45

• all interfaces support 10 Base-T, 100 Base-TX, 1000 Base-T

ANALOG GRAPHICS INTERFACE

• implemented by GM45 chipset:-

  • resolutions up to 2048 x 1536 @ 16M colors

• accessed via 26-way high-density connector

PMC/XMC INTERFACES

• 2 x PMC/XMC sites which support:-

  • 32/64-bit, 33/66/100/133 MHz PCI/PCI-X

  • 3.3V or 5V PCI signaling

  • separate PCI Express to PCI-X bridges

  • I/O via front panel

• XMC site 1 supports x4 PCI Express link

• XMC site 2 supports up to x8 PCI Express link:-

  • x4 if PMC PCI/PCI-X- bus enabled

  • dual x4 mode if PCI/PCI-X- bus site disabled

• site 1 rear PMC I/O via J5

• site 2 rear XMC I/O via J3

SERIAL INTERFACES

• 2 x RS232 serial channels:-

  • 1 x Tx/Rx channel accessed via a 26-way high-density connector on front panel

  • 1 x Tx/Rx channels via Transition Module

• 16550 compatible UARTs

• front panel supports CTS and RTS, and rear panel supports RI, CTS, RTS, DSR, DTR and DCD
  
  
   

OTHER PERIPHERAL INTERFACES

• PC Real Time Clock (Year 2000 compliant)

• watchdog timer; 32-bit Long Duration Timer with processor interrupt capability; chipset timer

• system fan monitor; CPU temperature monitor; voltages monitor; all accessible via IPMI

• 4 x USB 2.0 interfaces:-

  • 1 accessed via a 26-way high-density connector on front panel

  • 3 interfaces accessed via J5

• independent legacy speaker output via J3

• keyboard and mouse interfaces accessed via a 26-way high-density connector on front panel

IPMI

• PICMG 2.9 R1.0 (System Management Specification):-

  • implements the IPMB0 interface

  • implements an IPMB1 interface

• on-board Baseboard Management Controller

• supports 8 Kbytes of non-volatile memory

FIRMWARE SUPPORT

• Phoenix® Server BIOS

• comprehensive Power-On Self-Test (POST)

• LAN boot firmware included

SOFTWARE SUPPORT

• support for Linux®, Windows® XP, Windows® XP Embedded, Windows® Server 2003, QNX®, VxWorks® and Solaris™

FLASH EPROM

• 2 Mbytes of BIOS Flash EPROM

COMPACTPCI INTERFACE

• compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels (universal signaling support)

• 33/66 MHz, 32/64-bit interface accessed via J1/J2 connectors

• PCI Express to PCI bridge for off-board accesses

• J4 connector not fitted

• PICMG 2.1 R2.0 Hot Swap compliant

• operates as System Slot controller or in a Peripheral slot

• option to disable CompactPCI interface (Satellite Mode):-

  • receives power from CompactPCI bus

  • board can be hot swapped

ELECTRICAL SPECIFICATION

• +5V@TBA (typical at 2.53 GHz with 2 Gbytes DRAM); +5% / -3%

• +3.3V@TBA; +5% / -3%

• +12V@TBA; -12V@TBA

• +12V and -12V routed to PMC/XMC slots

SAFETY

• PCB (PWB) manufactured with flammability rating of 94V-0

ENVIRONMENTAL SPECIFICATION

• operating temperature:-

  • 0°C to +55°C (N-Series)

• 5% to 95% Relative Humidity, non-condensing (operating)

• -40°C to +85°C (storage)

• 5% to 95% Relative Humidity, non-condensing (storage)

MECHANICAL SPECIFICATION

• 6U form-factor: 9.2inches x 6.3inches (233mm x 160mm)

• single-slot: 0.8inches (20.3mm)

• connectors: IEC-1076-4-101 for J1-J5

• shock: 20g, 11ms, ½ sine (operating);
  30g, 11ms, ½ sine (non-operating)

• vibration: 5Hz-2000Hz at 2g, 0.38mm peak displacement (operating);
  5Hz-2000Hz at 5g, 0.76mm peak displacement (non-operating)