Specification Sheet: TP 302/32x

- Intel® Pentium® M Processor 3U Single Board Computer

CENTRAL PROCESSOR

• 1.8 GHz Intel® Pentium® M Processor 745:-

  • using a mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package

• 1.4 GHz Intel® Pentium® M processor Low Voltage 738:-

  • using a mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package

• common processor features are:-

  • 64 Kbytes of primary (L1) on-die cache

  • 2 Mbytes of secondary (L2) on-die cache

  • 400 MHz Front Side Bus (FSB)

• utilizes 64-bit Intel® 855GME chipset:-

  • supports 400 MHz bus frequency

  • uses Intel® 6300ESB I/O Controller Hub

• provision for ITP debug port

DRAM

• 1 Gbyte 333 MHz DDR SDRAM soldered onboard

HARD DISK INTERFACES

• EIDE interfaces:-

  • supports up to Ultra-DMA 100 for high performance drives

  • single slot board supports on-board type I or type II CompactFlash site (not available on dual slot variants)

  • optional second slot boards supports type I or type II CompactFlash site, 2.5 inch disk drive and EIDE header for external drives

  • 2 interfaces available simultaneously

• 2 x Serial ATA150 interfaces:-

  • two channels accessible via J2

  • transfer rate up to 150 Mbytes/s

ETHERNET INTERFACES

• 2 x channels supporting 10 Base-T, 100 Base-TX, 1000 Base-T:-

  • implemented by Intel® 82546GB via 64-bit 66MHz PCI bus

• both channels accessed via front panel RJ45 connectors

STEREO AUDIO

• AC '97 interface via J2

• independent legacy speaker output via J2

• codec on rear transition module

GRAPHICS INTERFACE

• implemented by the Intel® 855GME GMCH:-

  • resolutions up to 2048 x 1536 @75Hz on analog interface

  • resolutions up to 1400 x 1050 @ 60Hz on DVI-D interface

  • up to 16M colors

• analog interface accessed via a 15-way VGA connector on front panel

• DVI-D interface accessed via J2

SERIAL INTERFACES

• 4 x serial channels:-

  • 1 x RS232 and 1 x RS232/422/485 channels accessible via front panel on optional second slot board

  • 2 x serial channels (TTL) accessible via J2

• 16550 compatible UARTs

• supporting RI, CTS, RTS, DSR, DTR and DCD

FLASH EPROM

• 1 Mbyte of BIOS Flash EPROM

• application storage available on CompactFlash card

FIRMWARE SUPPORT

• Phoenix™ BIOS

• comprehensive Power-On Self-Test (POST)

• LAN boot firmware included

SOFTWARE SUPPORT

• supports Windows® 2000, Windows® XP, Windows® XP Embedded, QNX®, Linux® and VxWorks®

OTHER PERIPHERAL INTERFACES

• PC-compatible Real Time Clock (Year 2000 compliant)

• long duration timer

• watchdog timer

• CPU temperature monitor

• legacy speaker interface

• up to 4 x USB 2.0 interfaces:-

  • 1 via front panel

  • 1 via front panel on optional second slot board

  • 2 via J2

• PS/2 Keyboard and Mouse via single mini-DIN connector on optional second slot front panel

• 2 x GPIO signals via J2

COMPACTPCI INTERFACE

• compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels:-

  • universal signaling support

• 33/66 MHz; 32-bit interface accessed via J1

• utilizing a PCI-PCI bridge for off-board accesses

• operates as a System Slot controller supporting up to 7 peripheral slots

• supports hot-swapping peripheral boards:-

  • PICMG 2.1 R2.0 Hot Swap Specification

ELECTRICAL SPECIFICATION

• +5V@3.4A (typical at 1.8 GHz with 1 Gbyte DRAM)

• +3.3V@3.3A (typical at 1.8 GHz with 1 Gbyte DRAM)

• +12V and -12V not required

• all voltages are tolerant to +5% / -3%

SAFETY

• PCB (PWB) manufactured with flammability rating of 94V-0

ENVIRONMENTAL SPECIFICATION

• operating temperatures:-

  • 0°C to +55°C (N-Series: up to 1.8 GHz)

  • -25°C to +70°C (E-Series: 1.4 GHz)

  • -40°C to +85°C (K-Series: 1.4 GHz)

• 10% to 90% Relative Humidity, non-condensing (operating):-

  • K-Series includes humidity sealant

• -40°C to +85°C (storage)

• 10% to 90% Relative Humidity, non-condensing (storage)

MECHANICAL SPECIFICATION

• 3U form-factor: 3.9 inches x 6.3 inches (100mm x 160mm)

• single or dual slot

• connectors: IEC-1076-4-101 for J1-J2

• shock:
  20g, 11ms, ½ sine (operating);
  30g, 11ms, ½ sine (non-operating)

• vibration:
  5Hz-2000Hz at 2g, 0.38mm peak displacement (operating);
  5Hz-2000Hz at 5g, 0.76mm peak displacement (non-operating)