CENTRAL PROCESSOR

• 1.5 GHz Intel® Core™ 2 Duo processor L7400:-

  • using a mFC-BGA 478 (micro Flip-Chip Ball Grid Array) package

  • 64 Kbytes of primary (L1) on-die cache

  • 4 Mbytes of shared secondary (L2) on-die cache

  • 667 MHz Front Side Bus (FSB)

  • Intel® 64 Technology (64-bit computing)

• utilizes 64-bit Intel® 3100 server chipset:-

  • single chip chipset with integrated memory and I/O controllers

• provision for ITP debug port

DRAM

• 2 or 4 Gbytes soldered DDR2-400 registered ECC SDRAM using:-

  • single channel memory

  • single-bit error correction

  • peak bandwidth of up to 3.2 Gbytes/s

• accessible from processor or CompactPCI® bus

HARD/FLASH DISK INTERFACES

• Serial ATA150 interfaces:-

  • transfer rate up to 150 Mbytes/s

• 2 x channels accessible via J2

• 1 x channel routed to on-board 512 Mbytes Flash disk

• 2 x channels routed to optional Flash Disk Module:-

  • one or two Flash disk drives

  • appear as one or two hard disk drives

  • uses XMC connectors (see Note 1)

ETHERNET INTERFACES

• 2 x channels supporting:-

  • 10 Base-T, 100 Base-TX, 1000 Base-T

  • implemented by Intel® 82571EB via x4 PCI Express® port

  • both channels accessed via J2

OPTIONAL GRAPHICS INTERFACE

• optional PMC card mounted on 3U CompactPCI PMC carrier:-

  • see separate IO PMC/722 and TP CRx/PMC datasheets

• for IO PMC/722:-

  • implemented by Silicon Motion SM722

  • analog and digital graphics accessed via front panel DVI-I connector or PMC rear I/O

  • 8 Mbytes video memory

  • resolutions up to 1280 x 1024; supporting up to 16M colors

SERIAL INTERFACES

• 2 serial interfaces accessible via J2

• 1 x RS232 interface supporting Tx and Rx

• 1 x RS232 interface supporting Tx, Rx, RI, CTS, RTS, DSR, DTR and DCD or 1 x RS422/485 supporting Tx and Rx

• 16550 compatible UARTs

FLASH EPROM

• 1 Mbyte of BIOS Flash EPROM

• hardware write protect provided

FIRMWARE SUPPORT

• Phoenix™ TrustedCore BIOS

• Trusted Platform Module (TPM) support

• comprehensive Power-On Self-Test (POST)

• LAN boot firmware included

SOFTWARE SUPPORT

• supports Linux®, Windows® XP, Windows® XP Embedded, Windows® 2000, Windows® Server 2003,  QNX®, LynxOS® and VxWorks®

OTHER PERIPHERAL INTERFACES

• PC-compatible Real Time Clock (Year 2000 compliant)

• long duration timer

• watchdog timer

• legacy speaker interface

• 2 x USB 2.0 interfaces:-

  • both accessed via J2

• external battery supply for RTC and BIOS data

• 4 x GPIO signals via J2

• on-board I²C bus used for local temperature and power supply sensors, accessible via J1

COMPACTPCI INTERFACE

• universal signaling support, compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels

• 33/66 MHz; 32-bit interface accessed via J1

• utilizing a PCI Express-PCI bridge for off-board accesses

• operates as a System Slot controller (supporting up to 7 peripheral slots) or operates in a Peripheral Slot:-

  • supports hot-swapping peripheral boards

  • PICMG 2.1 R2.0 Hot Swap Specification

• option to disable CompactPCI interface (Satellite Mode):-

  • receives power from CompactPCI bus

  • board can be hot swapped

ELECTRICAL SPECIFICATION

• +5V@TBD A

• +3.3V@TBD A

• +12V and -12V not required

• all voltages are tolerant to ±5%

SAFETY

• PCB (PWB) manufactured with flammability rating of 94V-0

ENVIRONMENTAL SPECIFICATION

• operating temperatures:-

  • 0°C to +55°C (N-Series)

  • -25°C to +70°C (E-Series)

  • -40°C to +85°C (K-Series)

• storage temperature: -40°C to +85°C

• 10% to 90% Relative Humidity, non condensing (operating or storage):-

  • K-Series includes humidity sealant

• altitude (operating):
  0 to 15,000 feet (0 to 4,572 meters)

• ruggedized air-cooled version also available:-

  • see separate TP 402/351-RA datasheet

• ruggedized conduction-cooled version also available:-

  • see separate TP 402/351-RC datasheet

MECHANICAL SPECIFICATION

• 3U form-factor: 3.9 inches x 6.3 inches (100mm x 160mm)

• single slot

• connectors: IEC-1076-4-101 for J1-J2

• shock:
  20g, 11ms, ½ sine (operating);
  30g, 11ms, ½ sine (non-operating)

• vibration:
  5Hz-2000Hz at 2g, 0.38mm peak displacement (operating);
  5Hz-2000Hz at 5g, 0.76mm peak displacement (non-operating)

Note 1: The XMC connectors are provided for the SATA Flash Disk Module only.  The CPU heatsink for air-cooled boards does not allow an XMC module. The conduction-cooled board does support an optional XMC module (see separate TP 402/351-RC datasheet).