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New AdvancedMC™ module with PCI Express® connectivity
November 2016 – Concurrent Technologies announces AM F5x/msd, a new AdvancedMC™ Single Module based on the Skylake microarchitecture Intel®Xeon® Processor E3-1500 v5 family. With high performance PCI Express® (PCIe®) Gen 3 connectivity on the backplane, AM F5x/msd is designed for use in long life-cycle applications within the test, wireless, scientific and semiconductor markets.
AM F5x/msd users are able to specify a choice of processors including the Intel® Xeon® Processor E3 1505M v5 or Intel® Xeon® Processor E3-1505L v5, these are both 4-core devices with Intel® HD Graphics P530 and optimized for compute performance and low power consumption respectively. Alternatively, those customers with GPU intensive applications, can specify a version of AM F5x/msd fitted with the 4-core Intel® Xeon® Processor E3-1515M v5 which has Intel® Iris™ Pro Graphics P580 graphics capabilities. The processing capability is complemented with 16GB of soldered down DDR4 ECC DRAM for reliable, high speed memory access speeds and a removable solid state disk module with up to 128GB capacity for the Operating System, application code and data storage. For connection to additional AdvancedMC modules, AM F5x/msd can be used in a x4 or x8 PCIe lane configuration giving a maximum throughput of 7.8GB/s across the fabric interface. External connectivity includes a range of standard I/O interfaces including two 10GBASE-T Ethernet connections for high speed networking.
Glen Fawcett, CEO of Concurrent Technologies, commented:
“Our AdvancedMC modules appeal to a wide variety of applications and markets. Their modularity and relatively small form-factor makes it easy to create high performance embedded compute functions by inserting them into a backplane or carrier. Following on from our successful AM 91x/x1x series of modules, AM F5x/msd provides a useful performance increase with improved networking and extends our expected longevity for AdvancedMC modules beyond 2021.”
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