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Concurrent Technologies announces a 3U VPX conduction-cooled storage board with front removable modules
Suitable for mission data storage in rugged applications
Concurrent Technologies announces a 3U VPX conduction-cooled storage board with front removable modules, suitable for applications that need data mobility at the edge and developed in alignment with the SOSA™ Technical Standard. With a high bandwidth Gen 3 PCI Express® (PCIe) connection and two storage modules using NVMe protocol, TR MS7/600 is ideally suited for applications within the defense and aerospace markets. The key advantage of TR MS7/600, when compared to other conduction-cooled storage products from Concurrent Technologies, is the ability for the user to safely remove and replace the storage modules from the front.
TR MS7/600 is designed to work from -40°C to +85°C in highly challenging shock and vibration environments. The supplied solid storage modules offer excellent reliability and are provided in a range of capacities from 480GB to 3.8TB each. This adds up to a product capable of nearly 8TB of usable storage capacity based on current generation modules. The storage modules are hardware write protectable and are Opal 2.0 compliant for data at rest protection. By using a PCIe connection from the expansion plane on the host board, the read and write throughput is significantly faster compared to traditional SATA interface-based storage products.
Jane Annear, Managing Director of Concurrent Technologies, commented:
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“This new storage product is a perfect fit for Concurrent Technologies vision moving forward. We are seeing more requests for storage solutions mated with our processor products and TR MS7/600 fills a gap in our portfolio for data mobility at the edge by enabling front removeable storage solutions”.